Eleconic Vision has a
comprehensive range of system configurations catering to
customers’ needs, namely; Troy Series, Solar Series
and Uranus Series .
Series inspects unit on Jdec Tray.
Series inspectsunit on Stripe.
Series inspects individual or standalone In-tray
Eleconic’s inspection scan module is designed to
perform quality check on a wide range of IC configurations in
tray matrix, stripe matrix or single IC arrangements. “Single”
means individual IC placed on boat carriers or trackway. The
inspection can also be performed on-the-fly while the device
is moving in the handler. This on-the-fly inspection concept
allows overall machine throughput to be increased. The system
inspects for marking defects such as missing, wrong and blur
print, etc. Criteria for device sorting are achieved through a
set of tolerance values for individual parameters.
Troy Series (Unit
on Jdec Tray)
MBLTS – Mark Ball
Lead In-tray Scan
MBLTS Mark, Ball, Lead
In-tray Scan System caters to high speed and accurate pre-ball
and lead inspection and post-marking inspection.
MOS – Mark
MOS Mark Orientation Scan
System performs high speed in-tray marking inspection.
OCRS – Optical
Character Recognition Scan
OCRS Optical Character
Recognition Scan System processes 2D matrix code and character
optical recognition on IC packages in-tray.
Solar Series (Unit on
IDS – IC Deflash
Laser De-flash Scan is a high speed and accurate inspection
system to detect IC position and size on stripe. Inspection
results are transferred to laser system for IC burrs deflash.
Substrate Inspection Scan
SIS Substrate Inspection
Scan System inspects substrate surface defects. The full
colour system detects defects such as gold pads, fingers shape
and size, impurities and contaminants.
MOS – Mark
MOS Mark Orientation Scan
System allows on-the-fly marking defects inspection to be
performed on a variety of different stripe configurations.
CMS – Cross Mark
Cross Mark Scan System
involves on-the-fly inspection of the cross-markings prints on
stripe. This is to ensure selective laser marking on stripe
will be carried out quickly and accurately.
Uranus Series (Individual / Standalone Unit
TMLS – In-tape Mark
TMLS In-tape Mark Lead Scan
System executes marking, lead and orientation inspection of IC
DIPS – Dual
In-line Package Scan
DIPS Dual In-line Package
Scan System is designed to carry out high-speed marking and
lead inspection for PDIP packages. It inspects marking defects
such as incorrect, offset and inverted marks as well as lead
dimensional check such as lead spread, sweep, length deviation
SOMLS – SO
SOMLS Small Outline IC Scan
System performs high-speed marking and lead inspection on SOIC
BGYS – BGY
BGYS BGY Scan System carries
out dimensional and surface defect checks on BGY devices. It
measures defects such as burrs, missing grounds, access glue,
warp and oxidation.
Substrate Placement Scan
SPS Substrate Placement Scan
performs positional and size checks on substrate. The system
controls robot manipulator incorporating offsets correction
values for accurate substrate placement.
CADS – Cover
Adhesive Dispensing Scan
CADS Cover Adhesive
Dispensing Scan enables the inspection of glue positional
check on casing with a wide configuration. The inspection is
being performed while the casing is being indexed.
Electronic Monitoring Alignment Scan
EMAS Electronic Monitoring
Alignment Scan is developed to perform continual closed loop
inspection of micro-holes on electronic gun. This closed-loop
system allows optimal alignment to be achieved.
3DBLS – 3D
Ball Lead Scan
3DBLS 3D Ball Lead Scan
System provides highly accurate height measurement of ball and
lead for BGA and SOIC packages respectively.